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AMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech

Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report ....

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Corteva Declares Quarterly Dividend

/PRNewswire/ Corteva, Inc. (NYSE: CTVA) today announced its Board of Directors has authorized a common stock dividend of $0.16 cents per share, payable June. ....

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