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Chief executive officer Kwak Noh-Jung said the Nvidia supplier and the world's second-largest memory chipmaker will begin sending samples of the latest version of HBM chips, called 12-layer HBM3E, in May and begin mass producing them in the third-quarter.
SK Hynix plans to invest approximately $4 billion to establish an advanced chip-packaging facility in West Lafayette, Indiana, marking a significant step towards bolstering America’s semiconductor industry. This investment aligns with the Biden administration’s goals to reestablish the U.S. as a semiconductor powerhouse. Located near Purdue University, known for its extensive semiconductor and microelectronics-engineering programs, the facility will likely generate between 800 – 1,000 jobs, with