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TSMC partners with Ansys, Synopsys, and Cadence to boost silicon photonics program

TSMC partners with Ansys, Synopsys, and Cadence to boost silicon photonics program
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TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs. ....

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Intel Introduces Gaudi 3 AI Accelerator: Going Bigger and Aiming Higher In AI Market

Intel Introduces Gaudi 3 AI Accelerator: Going Bigger and Aiming Higher In AI Market
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Microchip introduces industry's most complete solution for 800G active electrical cables (AECs) used for generative AI networks – CIE

Microchip introduces industry's most complete solution for 800G active electrical cables (AECs) used for generative AI networks – CIE
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Maher Fahmi , Alan Weckel , Microchip Technology Inc , Development Package , Active Electrical Cables , Microchip Technology , Octal Small Form Factor Pluggable , Common Management Interface Specification ,

Retimer supports 800G AECs for generative AI networks

The rise of generative AI and AI/ML technologies is fueling demand for more high-speed connections and, in turn, the push toward 800G connectivity in backend data center networks and applications. This can be optimally addressed using Active Electrical Cables (AECs), but there are numerous design and development hurdles for cable vendors to overcome. To address ....

Redding Traiger , Microchip Technology Inc , Active Electrical Cables , Microchip Technology , Octal Small Form Factor Pluggable , Common Management Interface Specification ,