Fan-out packaging revenue growing at 12.5% CAGR
Fan-out (FO) packaging revenue is expected to reach $3.8 billion in 2028, with a CAGR 2022-2028 of 12.5%, says Yole Developpement. New Chinese OSATs are
Source: electronicsweekly.com
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Top News In Panel Level Packaging Today - Breaking & Trending Today
Manz AG starts the new year with realignment of Group organization and adjustment of reporting segments
DJ Manz AG starts the new year with realignment of Group organization and adjustment of reporting segments DGAP-Media / 2022-01-27 / 09:00 Manz AG starts the new year with realignment of Group organization
Source: finanznachrichten.de
Nepes Laweh corporation: Nepes Laweh to Set New Industry Benchmark With 600mm Large Panel M-Series Fan-Out Volume Production
Nepes Laweh corporation (Nepes: KOSDAQ 033640) announced the successful production of the world's first 600mm x 600mm large Panel Level Packaging (PLP) using Deca's M-Series fan-out technologies. This
Source: finanznachrichten.de
First 5nm processor to power next generation of wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920, for the next generation of wearable devices.
Source: newelectronics.co.uk
Samsung Introduces 5-nm Processor with GNSS for wearables - GPS World
The Exynos W920 is embedded with a GNSS L1 receiver (GPS, GLONASS, Beidou, Galileo) for tracking speed, distance and elevation during outdoor activities.
Source: gpsworld.com