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Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing Space systems
Munich, Germany, and Grenoble, France – 6 July, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Teledyne e2v (NYSE:TDY) have developed a reference design for the implementation of compute-intensive space systems. The design, built around a Teledyne e2v QLS1046-Space edge computing module, which is configured by the radiation-hardened 64MByte Infineon SONOS based…
Teledyne e2v and Infineon partner on optimized processor boot solution for high reliability edge computing space systems Jul 6, 2023| Market News ...
/PRNewswire/ -- Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs...