ASU gains $17.5m as part of $100m state funding to boost semiconductor development in Arizona
Expansion to create GaN manufacturing and research ecosystem
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Expansion to create GaN manufacturing and research ecosystem
The Arizona Commerce Authority announces a $17.5 million investment to help expand semiconductor research at ASU.
New top-side cooling packaging technology for RF power enables smaller, thinner and lighter radio units, supporting faster and easier deployment of 5G base...
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NXP Semiconductors has unveiled a new family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure.