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Elma's First-to-Market Cooling Platform Embraces Air Flow-Through (AFT) Per VITA 48.8 Standard – EEJournal

FREMONT, Calif., December 2021 – Elma Electronic Inc. has added a third model to its expanding CompacFrame series of next-generation development platforms designed to accelerate development and test of plug-in cards (PICs) aligned to the SOSA™ Technical Standard 1.0 and VITA 65 OpenVPX. In a first-to-market innovation, Elma’s new Type 39A CompacFrame holds up to accepts up to five… ....

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Rugged AI platform enhances inference computing in data-driven embedded systems

Rugged AI platform enhances inference computing in data-driven embedded systems
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Rugged AI Platform from Elma Enhances Inference Computing in Complex, Data-driven Embedded Systems

Technology Highlights: Powerful NVIDIA Jetson™ TX2i SoM Complex computation for AI-based applications Rugged and compact for use in autonomous, harsh and mobile environments FREMONT, Calif., October 2021 – The new Jetsys-5320 from Elma Electronic Inc. meets the growing data processing needs of extremely rugged and mobile embedded computing applications by easily handling data-intensive computation tasks. It provides complex… ....

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SOSA Aligned Development Platform Series from Elma Expanded to Include Midline CompacFrame

Technology Highlights: System development platform aligned with the SOSA™ Technical Standard, Edition 1.0 Up to eight air- or conduction-cooled slots for plug-in cards (PICs) Tilted card cage for easier access and viewing FREMONT, Calif., October 2021 – Elma Electronic Inc. is expanding its series of development platforms to include the 3U VPX mid-range CompacFrame that features… ....

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