Sponsored Content - High Reliability Underfills for Automotive Applications
Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and C
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Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and C
1 "Our WillScot Mobile Mini team concluded a transformational year and set the foundation for an exciting new chapter of growth and value creation, despite unprecedented operating challenges," said Brad Soultz, Chief Executive Officer of WillScot Mobile Mini Holdings. "Our portfolio continued to demonstrate its resilience in the fourth quarter as we grew our leasing and services revenue both sequentially and versus prior year, driven by 12.9% average rental rate growth in our NA Modular segment, and impressive rates and volumes in our Storage segments. New order rates, pricing, and value-adde...
1 "Our WillScot Mobile Mini team concluded a transformational year and set the foundation for an exciting new chapter of growth and value creation, despite unprecedented operating challenges," said Brad Soultz, Chief Executive Officer of WillScot Mobile Mini Holdings. "Our portfolio continued to demonstrate its resilience in the fourth quarter as we grew our leasing and services revenue both sequentially and versus prior year, driven by 12.9% average rental rate growth in our NA Modular segment, and impressive rates and volumes in our Storage segments. New order rates, pricing, and value-adde...