TE Connectivity's new board-to-board stacking connectors offer an economic way to upgrade COM Express applications to 16 GT/s speeds
Share this article Share this article HARRISBURG, Pa., Jan. 28, 2021 /PRNewswire/ -- TE Connectivity (TE), a world leader in innovative connectivity solutions for high-speed computing and networking applications, introduces a new generation of free height computer-on-module (COM) connectors in 0.5mm centerline to address vertical, parallel board-to-board connections that require high-speed data transmission and different stacking heights. These new connectors are compliant with the COM Express Type 7 specification and can be compatible with the PCIe Gen 4 protocol. Designed for higher speed a...