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Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

SANTA CLARA, Calif. – January 24, 2023 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today announced it has joined two key industry standardization efforts, bringing its expertise to enable more universal and cost-effective methods for implementing die-to-die interconnect in heterogenous single packaged systems. Eliyan will have… ....

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