Selective Soldering: A Need For Innovation and Development
Pillarhouse have undertaken extensive research to produce a new solder nozzle - surface engineered for longer life and increased wettability
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Pillarhouse have undertaken extensive research to produce a new solder nozzle - surface engineered for longer life and increased wettability
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.