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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
SAN JOSE, Calif., April 26, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the… ....
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies hpcwire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from hpcwire.com Daily Mail and Mail on Sunday newspapers.
Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.