Cadence Collaborates with GUC on AI, HPC and Networking in A

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

SAN JOSE, Calif., April 26, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the…

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Sanjive Agarwala , Glink Cowo , Dan Kochpatcharin , Igor Elkanovich , Nasdaq , Global Unichip Corp , Cadence Design Systems Inc , Ip Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems , Global Unichip , Intelligent System Design , Intelligent System Design Strategy ,

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