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Circuits Assembly Online Magazine - Indium Corporation Experts to Present at Electronics Packaging Technology Conference - Vimarsana News

Circuits Assembly Online Magazine - Indium Corporation Experts to Present at Electronics Packaging Technology Conference

The upcoming Electronics Packaging Technology Conference (EPTC) will feature presentations by two Indium Corporation experts. The conference, which takes place December 7–9 in Singapore, covers the complete spectrum of electronics packaging technology.

IDTechEx: The Impact of Newly Added US Sanctions on the Chinese Semiconductor Sector - Vimarsana News

IDTechEx: The Impact of Newly Added US Sanctions on the Chinese Semiconductor Sector

/PRNewswire/ -- On October 7, 2022, the United States announced a series of targeted updates to its export regulations concerning semiconductors and associated...

IDTechEx: The Impact of Newly Added US Sanctions on the Chinese Semiconductor Sector - Vimarsana News

IDTechEx: The Impact of Newly Added US Sanctions on the Chinese Semiconductor Sector

/PRNewswire/ -- On October 7, 2022, the United States announced a series of targeted updates to its export regulations concerning semiconductors and associated...

Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases - Vimarsana News

Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases

/PRNewswire/ -- Semiconductors are the critical component that enables our digital life. Their development has come a long way; In 1971, the Intel 4004, which...

India marks presence on chip-making map with Vedanta-Foxconn deal - Vimarsana News

India marks presence on chip-making map with Vedanta-Foxconn deal

Moving ahead towards the goal of Atmanirbhar Bharat, India is now all set to enter the market of chip-making with the deal between Indian multinational company Vedanta Limited and Taiwan's Foxconn.