If This NVIDIA Rumor Is True, Intel Just Scored a Major Foundry Win
Intel's advanced-packaging services may have scored a major new customer if a report out of Taiwan is accurate.
Source: yahoo.com
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PlayStation 5 Pro hardware rumors: 4nm Zen 2 CPU, 56 GPU cores, faster 18Gbps GDDR6 memory
Sony's beefed-up PlayStation 5 Pro console rumor: 4nm Zen 2-based 8-core CPU, 60 CUs on full die for GPU, 56 CUs planned for now with 16GB GDDR6 18Gbps.
Source: tweaktown.com
SK Hynix to build advanced plant in Indiana in boost to US chip self-sufficiency: FT, ET Telecom
SK Hynix: The company's new packaging plant in Indiana will specialise in stacking standard dynamic random access memory chips to create high-bandwidth memory (HBM) chips, before integrating them with Nvidia's graphic processing units (GPUs), the report said, citing sources.
Source: indiatimes.com
German chip parts supplier Siltronic posts 16% drop in 2023 sales, ET Telecom
Siltronic: The company, whose customers include Intel, TSMC and Samsung, reported preliminary 2023 revenue of 1.5 billion euros ($1.6 billion), matching analysts' average forecast in a poll by Vara Research.
Source: indiatimes.com
SK Hynix looks to Indiana for advanced chip packaging plant
People familiar with SK Hynix's plans said the HBM created in Indiana will be paired with Nvidia GPUs. Existing HBM chips from SK Hynix are manufactured in...
Source: techspot.com