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DOD Taps Intel Foundry for Commercial Chip Fabrication Program's Phase 3

Intel’s foundry business will further advance the development and testing of chip tape-outs and prototypes under the third phase of the Department of Defense’s Rapid Assured Microelectronics Prototypes-Commercial program. DOD awarded the RAMP-C program’s Phase 3 through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems other transaction authority agreement, also known as S2MARTS OTA, with the National Security Technology Accelerator, Intel said Monday. ....

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Raytheon wins $20m contract to make military 'super chips'

US defence specialist Raytheon is to develop develop a ....

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RTX Works With AMD To Develop Next-Gen Multi-Chip Package

RTX Works With AMD To Develop Next-Gen Multi-Chip Package
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AMD and Raytheon team up for advanced chip packaging for military applications

Raytheon aims to package state-of-the-art devices from partners like AMD into military-aimed multi-chip packages. ....

United States , Colin Whelan , Ryzen Ccds , Xilinx Fpgas , Red Team , Technology At Raytheon , Department Of Defense , Spectrum Missions Advanced Resilient Trusted Systems , Advanced Technology ,

Raytheon to Develop Multi-Chip Package Under NSTXL Deal

An RTX subsidiary is set to collaborate with industry partners for the development of a new technology that could enhance sensor capabilities across ground, maritime and airborne domains under a $20 million National Security Technology Accelerator contract. RTX said Thursday Raytheon will package commercial devices from partners like AMD to assemble a next-generation multi-chip package capable of transforming radio frequency energy into digital information with more bandwidth and higher data rates. ....

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