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Process Detector (For DVFS and monitoring process variation), TSMC N6 An embedded process detector circuit which helps Integrated Circuit (IC) developers to address the problem of process variability on low-geometry CMOS designs. The process detector provides the means to assess process variation from die to die and on chip variation across large die. Process detectors are especially useful in the bring up and characterization phase of new silicon, assessing and compensating for ageing and minimizing voltage guard bands through voltage scaling schemes. This In-Chip Sensing and PVT Monitor...

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP Winbond Electronics has announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP with the company's OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gbit. Winbond dev...

Temperature Sensor Deep NWELL, TSMC N3 A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an exclusively digital interface and includes a power down function to reduce standby current. The temperature sensor can be instanced multiple times in a single chip. Tight thermal control of device activity is essential for performance optimization, power efficiency and long-term reliability. This In-Chip Sensing and PVT Monitoring IP is available as part of the Synopsys DesignWare® Foundation IP portfo...

Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3 Wednesday Jul. 07, 2021 Distributed Thermal Sensor (DTS) Non-Deep NWELL, TSMC N3 The highly granular DTS offers a significant area reduction in comparison to some standard in-chip thermal sensor solutions and supports high accuracy measurement across a wide temperature range at enhanced conversion speeds. Thermal activity can be unpredictable and if not monitored carefully can cause over-heating and excessive power consumption which in turn impacts device longevity. The ability to make precise thermal measurements beside or within C...

May 27, 2021 Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC’s N3 Process Technology Real-Time Chip Insights Provide Optimized Device Utilization Throughout the Silicon Lifecycle for Leading Market Applications MOUNTAIN VIEW, Calif., May 27, 2021 /PRNewswire/ — Highlights for this Announcement: DesignWare PVT monitoring and sensing subsystem IP supports cutting-edge technologies targeting AI, data center, HPC, consumer and 5G markets Innovative, modular architecture offers new sensor technologies for advanced node devices Designers be...