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Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform

What are typically second- or third-order effects in 2D chip designs are elevated into primary effects in multi-die systems. It’s no wonder, given the . ....

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Intel Shows New Stacked CFET Transistor Design At ITF World

Intel’s Ann Kelleher showed a render of the new Complementary FET (CFET) transistor during her presentation at imec’s ITF World conference. ....

Ann Kelleher , Applied Materials , Interuniversity Microelectronics Centre , Intel Technology Development , System Technology Co , Technology Development , System Technology Co Optimization ,

IEDM 2021 Tutorials and Short Courses

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM T ....

United States , Wei Lu , Benjamin Colombeau , Hoi Jun Yoo , Hubregt Visser , Victor Moroz , Jeehwan Kim , John Paul Strachan , Roy Koret , Dechao Guo , Giacomo Indiveri , Asen Asenov , Dong Seup Lee , Robert Clark , Kai Zhao , Huaqiang Wu , Elyse Rosenbaum , Chung Hsun Lin , Scale Processes For Advanced Semiconductor Manufacturing , University Of Illinois , G Technology , Hilton San Francisco Union Square , Technology Co , Tsinghua University , University Of Zurich , Era Of Electronics ,