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Cadence Expands Collaboration with TSMC and Microsoft

Cadence Expands Collaboration with TSMC and Microsoft
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

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Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications

Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies

SAN JOSE, Calif., Oct. 27, 2021 Highlights: The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, ....

Chin Chi Teng , Suk Lee , Digital Signoff Group At Cadence , Design Infrastructure Management Division , Integrated Fan Out , Cadence Intelligent System , Cadence Integrity , Cadence Allegro , Cadence Virtuoso , Tempus Timing Signoff Solution , Cadence Voltus , Integrity Solution , Signoff Group ,

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the… ....

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Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs

Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

Chin Chi Teng , Suk Lee , Digital Signoff Group At Cadence , Design Infrastructure Management Division , Cadence Design Systems Inc , Design Systems , Cadence Tempus , Timing Signoff Solution , Integrated Fan Out , Cadence Intelligent System Design , Cadence Integrity , Cadence Allegro , Cadence Virtuoso , Tempus Timing Signoff Solution , Cadence Celsius , Thermal Solver , Cadence Voltus , Integrity Solution , Signoff Group ,