Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion Introduces ActiveCopper Filled Thermal Vias Kuprion, Inc., a spinout of Lockheed Martin, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems. Lead-free and RoHs-compliant, ActiveCopper is a flowable, engineered copper paste—a dense and sticky form of copper, which is safe to handle in air. To enhance heat and power dissipation, ActiveCopper Fill...
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