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Edinburgh Napier University launches new HPC and AI cluster

Edinburgh Napier University launches new HPC and AI cluster
datacenterdynamics.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from datacenterdynamics.com Daily Mail and Mail on Sunday newspapers.

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Aussie dad dies suddenly while holidaying in Bali

Aussie dad dies suddenly while holidaying in Bali
yahoo.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from yahoo.com Daily Mail and Mail on Sunday newspapers.

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NFI : Ambitious and complex CAVForth autonomous bus service trial launches in Scotland with Enviro200AV fleet from NFI subsidiary Alexander Dennis

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Larbert, UNITED KINGDOM - May 11, 2023: NFI Group Inc. , a leading independent bus and coach manufacturer and a leader in electric mass mobility solutions,... | May 11, 2023

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Jeromes Dream Share New Song "South By Isolation": Stream

Pioneering screamo faceblasters Jeromes Dream broke up in 2001, but they got back together in 2018 and released a reunion LP called LP in 2019. This spring, Jeromes Dream will follow that album with their new one The Grey In Between, recorded with producer Jack Shirley. This time around, they’re playing without guitarist Nick Antonopoulos; Loma Prieta’s Sean Leary has stepped in to fill his role. We’ve already posted the early track “Stretched Invisible From London,” and now Jeromes Dream have also shared a new one called “South By Isolation.”

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Former Innerleithen mill to become mountain bike innovation centre

The former Caerlee Mill in Innerleithen is to become a new Mountain Bike Innovation Centre after terms of purchase was agreed by South of Scotland Enterprise on behalf of the Borderlands Inclusive Growth Deal.

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Kuprion Introduces ActiveCopper Filled Thermal Vias


Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems. 
Lead-free and RoHs-compliant, ActiveCopper is a flowable, engineered copper paste—a dense and sticky form of copper, which is safe to handle in air. To enhance heat and power dissipation, ActiveCopper Filled Thermal Vias provide a more efficient heat dissipation path directly incorporated into PCBs with placement directly under a surface-mounted IC ‘heat source’ that allows direct surface mount bonding for maximum heat transfer using Kuprion’s surface mount copper material. Placing the large 3-5mm diameter thermal vias directly underneath an IC allows direct bonding to such a via, and enables significant reduction in thermal resistance. This facilitates efficient heat dissipation not only on the top surface, but through the PCB to the back side. 

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