TSMC's next-gen COUPE tech: silicon photonics packaging will be ready in 2026
TSMC is developing Compact Universal Photonic Engine (COUPE) technology to support the huge data transmission rates of the AI boom, coming in 2026.
Source: tweaktown.com
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TSMC Unveils Cutting-Edge A16 1.6nm Process Node, Targets 2026 Production Start
TSMC debuted new A16 Technology at its 2024 North America Technology Symposium yesterday.
Source: iclarified.com
Taiwan Earthquake: Taiwan rattled by dozens of quakes, but no major damage | World News
Rest of World News: Largely rural and sparsely populated Hualien was hit by a 7.2 magnitude earthquake on April 3 that killed at least 14 people, and there have been more
Source: indiatimes.com
SkyWater Technology Is Lowering Barriers To Advanced Chip Packaging
SkyWater has partnered with Deca Technologies to develop a multi chip packaging capability that will lower the entry barriers to advanced packaging.
Source: forbes.com
TSMC Just Gave Investors Another Reason to Be Bullish on Nvidia
The contract chipmaker's cautious outlook doesn't apply to the AI leader.
Source: yahoo.com