Micron Unveils UFS 4.0 Mobile Storage Using 232-Layer NAND For Huge Bandwidth Gains
Devices using these new NAND chips will benefit from double speed transfers compared to the previous gen UFS 3.1 solutions.
Source: hothardware.com
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Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry's Fastest Performance for Smartphones
Best-in-class mobile flash solution optimized for AI and 5G data-intensive flagship smartphonesBOISE, Idaho, June 21, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND. Offered in high capacities up to 1 terabyte (TB), the UFS 4.0 storage solution is being shipped to select global smartphone manufacturers and chipset vendors
Source: yahoo.com
Micron ships UFS 4.0 storage solution to mobile manufacturers and chipset vendors
Micron Technology is distributing samples of its latest mobile storage solution, the Universal Flash Storage (UFS) 4.0
Source: telecomlead.com
Micron samples UFS 4.0 chip
Micron Technology commenced sample shipments of a Universal Flash Storage 4.0 chip for use in flagship smartphones.
Source: mobileworldlive.com
Redmi Note 12 Pro 4G: A symphony of beauty, brains and brawn
A price tag of under Ksh. 40,000 makes the RedMi Note 12 Pro reasonably accessible and a good option for anyone in the market for a device.
Source: hapakenya.com