Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Del

Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry's Fastest Performance for Smartphones

Best-in-class mobile flash solution optimized for AI and 5G data-intensive flagship smartphonesBOISE, Idaho, June 21, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND. Offered in high capacities up to 1 terabyte (TB), the UFS 4.0 storage solution is being shipped to select global smartphone manufacturers and chipset vendors

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