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UMC Introduces Industry's First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era

Published: May 2, 2024

News Highlights: UMC's 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMC's innovative 3D IC technology...

Source: marketscreener.com

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United StatesSouth KoreaRaj VermaExchange CommissionWavetek Microelectronics CorporationUnited Microelectronics CorporationTechnology DevelopmentBusiness WireAssociate Vice President

UMC Introduces Industry's First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | National Business

Published: May 2, 2024

HSINCHU, Taiwan--(BUSINESS WIRE)--May 2, 2024--

Source: joplinglobe.com

Related Topics:

United StatesSouth KoreaRaj VermaFu TsauWavetek Microelectronics CorporationCorporate CommunicationsExchange CommissionTechnology DevelopmentUnited Microelectronics CorporationMicroelectronics CorporationBusiness WireAssociate Vice PresidentUnited MicroelectronicsNational Business

UMC Introduces Industry's First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | Business

Published: May 2, 2024

HSINCHU, Taiwan--(BUSINESS WIRE)--May 2, 2024--

Source: valdostadailytimes.com

Related Topics:

South KoreaUnited StatesFu TsauRaj VermaTechnology DevelopmentCorporate CommunicationsExchange CommissionUnited Microelectronics CorporationWavetek Microelectronics CorporationMicroelectronics CorporationBusiness WireAssociate Vice PresidentUnited Microelectronics

UMC Introduces Industry's First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | Region

Published: May 2, 2024

HSINCHU, Taiwan--(BUSINESS WIRE)--May 2, 2024--

Source: eagletribune.com

Related Topics:

South KoreaUnited StatesFu TsauRaj VermaTechnology DevelopmentCorporate CommunicationsExchange CommissionUnited Microelectronics CorporationWavetek Microelectronics CorporationMicroelectronics CorporationBusiness WireAssociate Vice PresidentUnited Microelectronics