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Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems
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Naoki Mimura , Shigeki Kato , Winbond Hyper , Winbond Hyperram Spistack , Division At Winbond Japan , Enterprise Infrastructure Business Division At Renesas , Winbond Electronics Corporation , Human Machine Interface , Mobile Industry Processor Interface , Product Features , Hybrid Sleep , Vice President , Enterprise Infrastructure Business Division , General Manager , மனிதன் இயந்திரம் இடைமுகம் , கைபேசி தொழில் ப்ரோஸெஸர் இடைமுகம் , ப்ராடக்ட் அம்சங்கள் , கலப்பு தூங்கு , துணை ப்ரெஸிடெஂட் , நிறுவன உள்கட்டமைப்பு வணிக பிரிவு , ஜநரல் மேலாளர் ,

Winbond's HyperRAM and SpiStack can now operate with Renesas' RZ/A2M MPUs

Winbond s HyperRAM and SpiStack can now operate with Renesasâ RZ/A2M MPUs
Winbond Electronics has confirmed that its HyperRAM and SpiStack (NOR+NAND) can now be operated with Renesasâ RZ/A2M Arm-based microprocessors (MPUs).
Renesasâ RZ/A2M is suitable for Human Machine Interface (HMI), especially HMI applications with cameras. It supports Mobile Industry Processor Interface (MIPI), a camera interface that is widely used in mobile devices, and is equipped with a dynamically reconfigurable processor (DRP) for high-speed image processing.
These MPUs also feature two Ethernet channels which can be used to enhance security functions with a cryptographic hardware accelerator. As a result, the RZ/A2M can be used to provide safer and more secure high-speed network connections which can be used for image recognition in broad system applications, from consumer electronics to industrial equipment. ....

Naoki Mimura , Winbond Hyper , Division At Winbond Japan , Winbond Electronics , Human Machine Interface , Mobile Industry Processor Interface , General Manager , மனிதன் இயந்திரம் இடைமுகம் , கைபேசி தொழில் ப்ரோஸெஸர் இடைமுகம் , ஜநரல் மேலாளர் ,

MIPI Drives Performance for Next-Generation Displays

MIPI Drives Performance for Next-Generation Displays
By Mixel, Rambus, and Hardent
In late 2000, Nokia announced its iconic 3310 handset which featured an 84×48-pixel pure monochrome display. Seven years later, Apple unveiled its first iPhone with a 90mm (3.5”) screen and 320×480-pixel resolution (at 163 ppi). Cameras and high-quality displays quickly became the de-facto standard for smartphones by the mid-2000s. However, proprietary interface solutions for connecting cameras and displays to mobile processors lacked the standardization needed to make sense of the chaos of sourcing these components in a rapidly growing mobile phone market.
The Mobile Industry Processor Interface (MIPI®) Alliance was formed in 2003 to address the fragmentation in the essential video interface technologies for cameras and displays in phones. In later years, the alliance significantly expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip, contr ....

Video Electronics Standards Association , Mobile Industry Processor Interface , Mobile Display Digital Interface , Serial Interface , Command Set , Display Stream Compression , Next Generation , காணொளி மின்னணுவியல் தரநிலைகள் சங்கம் , கைபேசி தொழில் ப்ரோஸெஸர் இடைமுகம் , சீரியல் இடைமுகம் , கட்டளை அமை , காட்சி ஸ்ட்ரீம் சுருக்க ,