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Winbond's HyperRAM and SpiStack can now operate with Renesas’ RZ/A2M MPUs Winbond Electronics has confirmed that its HyperRAM and SpiStack (NOR+NAND) can now be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs). Renesas’ RZ/A2M is suitable for Human Machine Interface (HMI), especially HMI applications with cameras. It supports Mobile Industry Processor Interface (MIPI), a camera interface that is widely used in mobile devices, and is equipped with a dynamically reconfigurable processor (DRP) for high-speed image processing. These MPUs also ...

HyperRAM to be integrated with Apollo4 Winbond, the Taiwan memory producer, is collaborating with Ambiq, the MCU and real-time clock specialist, to combine Winbond’s HyperRAM and Ambiq’s Apollo4 SoC to deliver system chips for IoT endpoints and wearables. Several customers are in design with Ambiq’s Apollo4 and Winbond 256Mbx8 HyperRAM Hybrid Sleep Mode (HSM), with volume production expected in 2022. HSM power consumption claims to be about 50% compared to normal standby mode. The Apollo4 hardware/software solution is purpose-built to allow battery-powered endpoint devices to achieve a ...