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Imec demonstrates first sub-5mW, IEEE 802.15.4z UWB transmitter chip Imec has showcased the first IEEE 802.15.4z impulse-radio ultra-wideband (IR-UWB) transmitter chip at the International Solid-State Circuits Conference (ISSCC). The device has been designed to strike a better balance between UWBâs accurate and secure ranging capabilities for indoor localization and the need for increased energy efficiency. Fabricated in 28nm CMOS (with an occupied core area of only 0.15mm²), the chip aims to enable the next generation of cost-effective, small form-factor UWB deployments. It has been custom-developed and is able to achieve a record-low power consumption of 4.9 milliwatt (mW) in a standard-compliant operation, while adhering to UWBâs spectral emission regulations. ....
E-Mail IMAGE: Princeton researchers have created a new chip that speeds artificial intelligence systems called neural nets while slashing power use. The chips could help bring advanced applications to remote devices such. view more Credit: Hongyang Jia/Princeton University Responding to artificial intelligence s exploding demands on computer networks, Princeton University researchers in recent years have radically increased the speed and slashed the energy use of specialized AI systems. Now, the researchers have moved their innovation closer to widespread use by creating co-designed hardware and software that will allow designers to blend these new types of systems into their applications. Software is a critical part of enabling new hardware, said Naveen Verma, a professor of electrical and computer engineering at Princeton and a leader of the research team. The hope is that designers can keep using the same software system - and just have it wo ....
Credits: Image: courtesy of the researchers, edited by MIT News Previous image Next image Researchers have developed a data transfer system that can transmit information 10 times faster than a USB. The new link pairs high-frequency silicon chips with a polymer cable as thin a strand of hair. The system may one day boost energy efficiency in data centers and lighten the loads of electronics-rich spacecraft. The research was presented at this month’s IEEE International Solid-State Circuits Conference. The lead author is Jack Holloway ’03, MNG ’04, who completed his PhD in MIT’s Department of Electrical Engineering and Computer Science (EECS) last fall and currently works for Raytheon. Co-authors include Ruonan Han, associate professor and Holloway’s PhD adviser in EECS, and Georgios Dogiamis, a senior researcher at Intel. ....
Data transfer system connects silicon chips with a hair's-width cable scienceblog.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from scienceblog.com Daily Mail and Mail on Sunday newspapers.
Feb 23, 2021 13:22 EST The Taiwan Semiconductor Manufacturing Company s (TSMC) chairman Dr. Mark Liu has confirmed that the company s next-generation 3nm chip manufacturing node is on schedule. TSMC, which supplies processors to customers all over the world is currently building a facility to manufacture 3nm chips, and the company hopes to commence production for these products next year. Show Details TSMC s 3nm Will Nearly Double Logic Density Over Its 5nm Node and Deliver an 11% Performance Boost or 27% Power Efficiency Gain The executive s comments regarding his company s next manufacturing technology confirm that TSMC believes that it will be able to manage both the increased demand for its current and future products at the same time - without letting the recent uptick in demand for automobile products affect its output. They came during his talk at the International Solid-State Circuits Conference (ISSCC) titled Unleashing the Future of Innovation g ....