TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
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TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
Demos Will Feature One-Stop Design Enablement Solutions for Device Characterization, SPICE Modeling, PDK Development Other Demos Include Far-Ranging Capabilities of Circuit Simulation and Analysis Portfolio, Cloudy-Ready Standard Cell Characterization Solutions SAN JOSE, CALIF. –– July 6, 2023 –– Primarius Technologies will showcase its Design-Technology Co-Optimization (DTCO)-enabled EDA solutions powered by the latest generation SPICE and…
SUNNYVALE, Calif., June 28, 2023 /PRNewswire/ -- Responding to significant market growth in high-performance computing, AI, mobile and automotive applications, Synopsys, Inc. (Nasdaq: SNPS) today announces a collaboration with Samsung to develop optimized digital and custom design flows on Samsung Foundry's SF2 process. This collaboration builds on the success of Synopsys' certified digital and custom design flows for Samsung Foundry's…
Announcement Highlights: Samsung targets mass production of 2nm process technology by 2025 and 1.4nm by 2027 Samsung plans to expand its production capacity for the advanced nodes by more
Despite roadblocks from the U.S., SMIC continues to develop thinner nodes.