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TSMC and SK Hynix team up for HBM4 co-production: Report

TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory. ....

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HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface
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Primarius to Showcase DTCO-Enabled EDA Solutions at DAC Powered by Next-Generation SPICE and FastSPICE Technology

Demos Will Feature One-Stop Design Enablement Solutions for Device Characterization, SPICE Modeling, PDK Development Other Demos Include Far-Ranging Capabilities of Circuit Simulation and Analysis Portfolio, Cloudy-Ready Standard Cell Characterization Solutions SAN JOSE, CALIF. –– July 6, 2023 –– Primarius Technologies will showcase its Design-Technology Co-Optimization (DTCO)-enabled EDA solutions powered by the latest generation SPICE and… ....

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Primarius to Showcase DTCO-Enabled EDA Solutions at DAC Powered by Next-Generation SPICE and FastSPICE Technology

Primarius to Showcase DTCO-Enabled EDA Solutions at DAC Powered by Next-Generation SPICE and FastSPICE Technology
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Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process – EEJournal

SUNNYVALE, Calif., June 28, 2023 /PRNewswire/ Responding to significant market growth in high-performance computing, AI, mobile and automotive applications, Synopsys, Inc. (Nasdaq: SNPS) today announces a collaboration with Samsung to develop optimized digital and custom design flows on Samsung Foundry's SF2 process. This collaboration builds on the success of Synopsys' certified digital and custom design flows for Samsung Foundry's… ....

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