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IIM Bangalore Convocation 2021: Five Powerful Career Mantras by IBM Chairman Dr. Arvind Krishna


MBAUniverse.com News Desk | : 
April 17, 2021
IIMB hosted its 46th Convocation on April 16, 2021. The highlight of the ceremony was a motivational address by Dr. Arvind Krishna, Chairman and CEO of IBM, where he shared five powerful mantras for personal and business success. MBAUniverse.com presents the highpoints from this address, and other Convocation highlights.
Amidst the rapidly spreadingsecond wave of Coronavirus, IIMB hosted its 46th Convocation on April 16, 2021. The entire ceremony, held in the virtual mode, witnessed the graduation of 624 students from various programmes. The highlight of the program was a motivational address by Dr. Arvind Krishna, Chairman and CEO of IBM, where he shared five powerful mantras for personal and business success. MBAUniverse.com presents the highpoints from this address, and other Convocation highlights. ....

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IBM's Arvind Krishna to deliver IIMB's 46th convocation address on April 16


IBM’s Arvind Krishna to deliver IIMB’s 46th convocation address on April 16
April 12, 2021
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IBM’s Chairman and Chief Executive Officer Arvind Krishna will deliver the Indian Institute of Management Bangalore (IIMB) 46th convocation address on April 16.
This year’s convocation will be in the virtual mode and includes the announcement of gold medals. Students are to graduate in the virtual presence of Arvind Krishna; Devi Prasad Shetty, Chairperson, Board of Governors, IIMB; Rishikesha T Krishnan, Director, IIMB; eminent Board members and members of the faculty.
Devi Prasad Shetty and Rishikesha T Krishnan will share their message and highlight achievements and accomplishments of the institute. ....

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Mold-Tek Packaging Limited Board declares Interim Dividend of Rs. 3


Mold-Tek Packaging Limited Board declares Interim Dividend of Rs. 3
Posted On:
2021-03-08 04:42:36
(Time Zone: Arizona, USA)
The Board of Directors of Mold-Tek Packaging Ltd at its meeting held on March 08, 2021, have declared an Interim Dividend for the financial year 2020-21, @ 60 % i.e., Rs. 3/- per Equity share on face value of Rs. 5/- per share.
The Interim Dividend declared shall be paid on or from March 20, 2021 to April 07, 2021.
Further, the Partly Paid Equity Shareholders of the Company will receive the dividends in proportion to the amount paid up on the Equity Shares.
Shares of Mold-Tek Packaging Limited was last trading in BSE at Rs.420.35 as compared to the previous close of Rs. 409.7. The total number of shares traded during the day was 7113 in over 321 trades. ....

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