Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology – EEJournal

SAN JOSE, Calif., April 24, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology. Implemented on TSMC’s 3DFabric™ CoWoS-S silicon interposer technology, the IP offers ultra-high bandwidth density, efficient low-power performance and superior low latency, making it ideal for…

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