Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System- in-Package

Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in- Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in- Package while delivering the performance and flexibility expected from the Zynq UltraScale+…

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