TSMC Accelerates Expansion of Advanced Packaging Facilities: Report

Due to high demand for AI and HPC GPUs, TSMC is accelerating pace of its expansion of advanced packaging facilities.

Related Keywords

Germany ,Japan ,Taiwan ,Taiwanese , ,Amkor Technology ,Nvidia ,Broadcom ,Xilinx ,Siliconware Precision Industries ,United Microelectronics ,Rudolph Technologies ,Grand Process Technology ,Southern Taiwan Science Park ,Advanced Backend Fab ,