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Ultrafast Lasers Gaining Traction for Their High Dimensional Precision & Application in Military Equipment Manufacturing: Fact MR
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What is Particle Measuring?
The process of sizing and counting particulates in a sample is called particle measuring and can be performed in either liquid or air. Industrial processes such as semiconductor wafer fabrication use this technique prominently.
These processes have a requirement of high fluidic purity and are especially concerned with the presence of particulate contaminants as they can lead to system damage or product waste.
The Challenge
Particle measurement is used in semiconductor wafer fabrication processes to ensure that cleaning, cooling, and chemical fluids are contaminant-free. The space required and size of the equipment needing for performing this analysis has started to become an issue for industries like these as they begin to leverage the power of particle measuring against contamination.
Product Announcement
Compact, exceptional beam roundness (>93%) and reproducible beam characteristics. Configured for OEMs, the dart, 8 picosecond laser is ideal for micromachining
14 Apr 2021
Drawing on a wealth of technical and application experience from our ARGES and Laser Quantum engineering teams, we have developed Dart, a picosecond laser solution with reliable, repeatable operation to ensure precision in a multitude of applications.
Dart offers a leading design for a range of precision processing and microelectronic applications with multiple power levels, wavelengths, and pulse parameters available. Each laser delivers excellent beam quality with the M
2 close to the diffraction limit and near-perfect beam roundness (>93% typically across 2 Rayleigh lengths) ensuring clean material processing.
Light, which can be seen by the human eye has a much longer wavelength compared to electrons. In fact, objects can be magnified up to an unrivaled 200,000x using an electron beam with outstanding degrees of chemical specificity.
Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) are the two main types of EM. While each technique employs the same fundamental apparatus to yield a focused electron beam that is directed onto the object of interest, they differ in how the samples are illuminated.
A TEM utilizes a fluorescent screen to produce a projection image while an SEM employs a range of deflector coils to modify the beam path and raster scan the sample. A continuous wave (CW) electron beam is predominantly used in each of these systems which fails to deliver appropriate temporal information.
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