A Chiplet Interconnection Specification Optimized For Maximum Applicability Enabling Low Cost And Energy Efficient Implementations Austin News Today : Breaking News, Live Updates & Top Stories | Vimarsana
A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High Bandwidth Interconnect (OpenHBI) PHYspecification targeting High Bandwidth Memory and other parallel bandwidth intensive use cases. "The demand for specialized silicon has been increasing steadily due to workload diversity, such as with the adoption of AI and