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Chip Industry Week In Review

Chip Industry Week In Review
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ZTE CEO Xu Ziyang: Convergence and Innovation - Build Phygital DNA for Faster Growth

ZTE CEO Xu Ziyang: Convergence and Innovation - Build Phygital DNA for Faster Growth
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Xu ziyangCloud foundationNetwork convergenceChina telecom sichuanDigital first networksDuring the digital first networksOutstanding contributionAsia mobile industry awardMobile awardsShannon limitPower usage effectivenessDomain specific architectureOptical cross connectsReconfigurable intelligent surfaceEast to west computing resource transferBenxi tool

ZTE Corporation: ZTE CEO Xu Ziyang: Convergence and Innovation - Build Phygital DNA for Faster Growth

ZTE Corporation: ZTE CEO Xu Ziyang: Convergence and Innovation - Build Phygital DNA for Faster Growth
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Hong kongXu ziyangDigital first networksDuring the digital first networksNetwork convergenceChina telecom sichuanCloud foundationOutstanding contributionAsia mobile industry awardMobile awardsShannon limitPower usage effectivenessDomain specific architectureOptical cross connectsReconfigurable intelligent surfaceEast to west computing resource transfer

Executive Insights: Shaping Digital Innovation

We are now experiencing a surging digital wave. Digital transformation is changing the world faster than ever before, driving new growth in various fields, from life to production, from individuals to organizations. #sponsored

Network interface cardsShannon limitDomain specific architecture

Open Compute Project Foundation (OCP) Announces a Proven SoC Disaggregation Interface Specification

A Chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations. AUSTIN, Texas, July 20, 2022 /PRNewswire/ Today, the OCP Foundation, the nonprofit organization bringing hyperscale innovations to all, announced the release of the Bunch of Wires (BoW)specification for Chiplet interconnect. The BoW specification represents a next step in the OCP Open Domain Specific Architecture (ODSA) Project'smarch towards establishing an open Chiplet ecosystem as a catalyst for a new silicon market place and integrated circuit supply chain model. BoW specifies a physical layer (PHY) optimized for System on a Chip (SoC) disaggregation, and complements OCP ODSA Open High Bandwidth Interconnect (OpenHBI) PHYspecification targeting High Bandwidth Memory and other parallel bandwidth intensive use cases. "The demand for specialized silicon has been increasing steadily due to workload diversity, such as with the adoption of AI and

United statesDirk van slykeBill carterTom hackenbergComputing divisionComputing software semiconductorDomain specific architectureHigh bandwidth interconnectHigh bandwidth memoryPrincipal analystSoftware semiconductorOpen compute projectChief marketingCentral timeCompute projectA chiplet interconnection specification optimized for maximum applicability enabling low cost and energy efficient implementations austin