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November 25, 2023
President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading edge chips while bolstering semiconductor production in the US. He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of…
November 21, 2023
One reason for the sudden focus on that special sauce is its necessity to the kind of high-power semiconductors needed for artificial intelligence applications.
November 21, 2023
Semiconductor Manufacturing: Assembly, testing and packaging – usually considered together as “back-end” manufacturing - was always the least glamorous end of the semiconductor industry, with less innovation and lower added value than the “front end” business of making chips with features measured in the billionths of a meter.
June 8, 2023
Taiwan’s TSMC, the world’s No. 1 foundry player, has begun developing a 2-nm process, widening its gap with its competitors.
June 8, 2023
HSINCHU, Taiwan, R.O.C, Jun. 8, 2023—TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one [...]
August 8, 2022
World's number one semiconductor foundry TSMC has announced The completion of its Cleanroom at its Japan 3DIC R&D Center in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST).
June 24, 2022
IBARAKI, Japan, June 24, 2022 — TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed [...]
June 17, 2022
Demand for advanced packaging technologies is largely fulfilled by the manufacturers present in countries of Europe and North America regions.
March 29, 2022
KUALA LUMPUR (March 29): Here is a brief look at some of the corporate announcements and news flow on Tuesday (March 29), involving Advanced Packaging Technology (M) Bhd, Artroniq Bhd, Petronas Gas Bhd, Pos Malaysia Bhd, Yinson Holdings Bhd, Kronologi Asia Bhd, Apollo Food Holdings Bhd, Hiap Teck Venture Bhd, Kim Loong Resources Bhd, LB Aluminium Bhd and SCGM Bhd.
March 14, 2022
Hsinchu, Taiwan – March 10, 2022 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total…