GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs
Hsinchu, Taiwan – March 10, 2022 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total…
United States Sean Tai Igor Elkanovich Taiwan Stock Exchange D Advanced Packaging Technology Global Unichip Corp
Source: eejournal.com