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June 1, 2023
Display driver IC (DDI) backend specialist Chipbond Technology has shifted its attention to non-DDI chips and devices such as RF components and power amplifiers, which will account for 35% of the companys revenue this year, according to company chairman Fei-Jain Wu. The proportion already came to 32% in 2022.
April 10, 2023
Taiwan-based OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%.
July 28, 2022
/PRNewswire/ -- Flip chip technology is an advanced packaging method that uses conductive bumps to interconnect the chip and the substrate. It provides better...
July 14, 2022
Description New Research Study ""Semiconductor Assembly and Testing Services Market 2022 analysis by Market Trends (Drivers, Constraints, Opportunities,