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June 12, 2023
Oki Electric Industry Co., Ltd. Oki Electric Cable Co., Ltd. OKI Launches Two Types of Environment-Proof FPC for Use in High-Temperature,... | June 12, 2023
June 12, 2023
-Capable of being used in 200°C high-temperature environments and equipment requiring high-pressure steam sterilization- ... | June 12, 2023
September 20, 2022
LG Innotek announced that it will participate in the International Electronic Circuits & Packaging Show 2022 held at Songdo Convensia in Incheon from Sept. 21 to 23 and introduce new substrate materials, according to the company, Tuesday. At the exhibition organized by the Korea Electronics Packaging and Circuits Association (KPCA), LG Innotek will unveil three innovative substrate products: flip-chip ball grid array (FC-BGA) substrate, package substrate and tape substrate.