LG Innotek to take part in KPCA show 2022
LG Innotek announced that it will participate in the International Electronic Circuits & Packaging Show 2022 held at Songdo Convensia in Incheon from Sept. 21 to 23 and introduce new substrate materials, according to the company, Tuesday. At the exhibition organized by the Korea Electronics Packaging and Circuits Association (KPCA), LG Innotek will unveil three innovative substrate products: flip-chip ball grid array (FC-BGA) substrate, package substrate and tape substrate.
South Korea Songdo Incheon Songdo Convensia Circuits Association International Electronic Circuits Korea Electronics Packaging
Source: koreatimes.co.kr