Keysight joins TSMC OIP 3D Fabric Alliance
Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric Alliance formed to accelerate 3D IC ecosystem innovation and readiness. The membership will allow the US vendor to utilize the TSMC 3Dblox standard to develop electronic design automation (EDA) software and testing solutions.
D Fabric Alliance Keysight Technologies Innovation Platform Dfabric Alliance D Fabric Hips Components
Source: digitimes.com