Page 5 - Dan Kochpatcharin News Today

Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores for designing System-on-Chip (SOC)

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies May. 16, 2023 News Content: Cadence 112G-LR SerDes... | May 16, 2023

Membership provides access to TSMC’s 3Dblox standard for electronic design automation software and device testing solution development   ... | May 4, 2023

Cadence Design Systems, Inc. today announced that it has collaborated with TSMC to optimize the Cadence Virtuoso platform for the...

To accelerate development of advanced radio frequency (RF) and millimeter wave (mmWave) designs with high reliability, Synopsys, Inc. (Nasda...

SAN JOSE, Calif., April 25, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with TSMC to optimize the Cadence® Virtuoso® platform for the 79GHz mmWave design reference flow on TSMC’s N16 process. With this latest development in Cadence and TSMC’s long history of collaboration, joint customers now have access to a complete…

SAN JOSE, Calif., April 26, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC). This milestone in the companies’ ongoing and successful collaboration solidifies Cadence’s leadership in high-performance connectivity IP for the high-bandwidth, high-reliability products that power the…

Cadence Design Systems is working with TSMC to optimise its Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.

Synopsys has announced that it is strengthening its collaboration with TSMC and Ansys for multi-die system design and manufacturing.

Combining electronic design automation (EDA) parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating cloud-optimized design methodologies.