Die Stacking News Today

Intel's next-generation Meteor Lake is a rethink of how its processors are put together, now with a tile-based chiplet design that includes dedicated AI processing capabilities, a new kind of cores, and an emphasis on efficiency. Here's the lowdown.

26 May 2021, 01:05 am AMD gets mixed in on the recent leak involving its EPYC chip that will be getting a new 3D die stacking technology feature. According to the GPU leakers, the company is now embracing a group of new-age processors that will be centered on the Milan-X series variant. AMD Rumors Circling EPYC Milan-X Processor (Photo : Timothy Dykes from Unsplash) AMD EPYC Milan-X is believed to feature a new 3D die technology. According to the latest report of Toms Hardware on Wednesday, Ma...