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Sk Hynix Inc Announces Plans to Establish New Advanced Packaging Fabrication and R&D Facility for High-Intensity and Ai Microelectronic Products and Applications in Indiana

Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University President Mung Chiang joined federal partners and executives of South Korea-based SK hynix Inc., the world?s.

West lafayetteUnited statesPurdue universityMung chiangDavid rosenbergEricj holcombPurdue research parkGovernor ericCommerce david rosenbergPurdue university president mung chiangSouth korea basedHigh bandwidth memoryDynamic random access memory

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

/PRNewswire/ SK hynix Inc. (or "the company", www.skhynix.com), the world s leading producer of High-Bandwidth Memory (HBM) chips, announced today that it.

Purdue universityUnited statesSoult ukpyolsiSouth koreaState of indianaWest lafayetteRepublic of koreaJeong joon yuJunghan kimDavid rosenbergArun venkataramanChoi woojinMung chiangLafayette erin easterKwak noh jungStates hyundong cho

Maker of AI chip announces $3 87B facility, largest-ever investment in Indiana

Purdue's president said SK Hynix's investment would be the largest ever in Indiana and move the state to the forefront of AI in America.

United statesPurdue universityWest lafayetteState of indianaSouth koreaRepublic of koreaKwak noh jungStates hyundong choTodd youngJeong joon yuMung chiangJunghan kimMark lundstromArun venkataramanLafayette erin easterDavid rosenberg

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.

South koreaUnited statesWest lafayetteState of indianaSoult ukpyolsiPurdue universityRepublic of koreaDavid rosenbergJunghan kimJeong joon yuMung chiangChoi woojinArun venkataramanStates hyundong choKwak noh jungLafayette erin easter

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
thailand-business-news.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from thailand-business-news.com Daily Mail and Mail on Sunday newspapers.

United statesState of indianaWest lafayetteSoult ukpyolsiSouth koreaPurdue universityRepublic of koreaLafayette erin easterKwak noh jungChoi woojinDavid rosenbergTodd youngJeong joon yuArun venkataramanEric holcombMung chiang