EK launches EK-Loop nano-grade thermal paste
EK announced the release of the EK-Loop Thermal Paste NGP (5g), a thermal interface material designed for high-end components. This paste uses nano-grade particles to ensure efficient heat transmission between CPUs, GPUs, and other chipsets and their cooling solutions, such as water blocks and heatsinks. Built on Nano-Grade Particles (NGP) technology, the EK-Loop NGP thermal …
Source: kitguru.net