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April 5, 2024
Experience unmatched cooling with EK’s NGP Thermal Paste, designed for easy application and peak performance across all devices
April 5, 2024
EK announced the release of the EK-Loop Thermal Paste NGP (5g), a thermal interface material designed for high-end components. This paste uses nano-grade particles to ensure efficient heat transmission between CPUs, GPUs, and other chipsets and their cooling solutions, such as water blocks and heatsinks. Built on Nano-Grade Particles (NGP) technology, the EK-Loop NGP thermal …