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United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023

SAN JOSE, Calif., October 3, 2022 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Voltus™-XFi Custom Power Integrity solution is now optimized and certified for use with Samsung Foundry’s advanced 5LPE process technology. Joint customers can confidently integrate the Cadence Voltus-XFi solution with Samsung Foundry’s PDKs to create ICs for next-generation hyperscale…

Cadence and Samsung Foundry continue collaboration to enable low-power IC design and verification ... | October 3, 2022

AGFY earnings call for the period ending June 30, 2022.

Highlights: • Cadence and TSMC collaborate on N6RF design enablement to accelerate innovation in mobile, 5G and wireless applications • Joint customers are designing with the new PDK based on the N6RF design flow SAN JOSE, Calif., June 17, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Cadence RFIC solutions are enabled to support…

Highlights: • Companies collaborate to accelerate next-generation mobile, AI and hyperscale design innovation • Customers actively designing with new N3E and N4P PDKs • Cadence digital and custom/analog flows optimized to support N3E and N4P requirements, enabling optimal PPA results and improved designer productivity SAN JOSE, Calif., June 13, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS)…

Highlights: • Certification enables customers to advance the design of aerospace, hyperscale computing, AI, mobile and consumer applications using Cadence and GF® technologies • Cadence digital full flow optimized for the GF 12LP/LP+ process platforms enables mutual customers to reach PPA goals faster and deliver new products to market with shorter design cycles SAN JOSE,…

•  GF qualifies the Cadence digital solution on AWS for its proprietary, differentiated 22FDX platform • Xenergic leverages the Cadence Cloud Passport to tape out test chip featuring Tensilica Fusion F1 DSP and low-power memories on the GF 22FDX platform SAN JOSE, Calif., March 23, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that GlobalFoundries®…

Press release content from Business Wire. The AP news staff was not involved in its creation.

Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive…