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TSMC orders more AI chip packaging equipment for Amazon, AMD, Nvidia

September 26, 2023

TSMC has increased orders for CoWoS packaging machines by 30% to cope with increased AI chip demands from Amazon, AMD, Broadcom, and Nvidia. - SamMobile

Scientech Corporation Group Up Industrial Er Engineering Corporation Taiwan Economic Daily Grand Process Technology

Source: sammobile.com

TSMC Accelerates Expansion of Advanced Packaging Facilities: Report

July 14, 2023

Due to high demand for AI and HPC GPUs, TSMC is accelerating pace of its expansion of advanced packaging facilities.

Amkor Technology Siliconware Precision Industries United Microelectronics Rudolph Technologies Grand Process Technology Southern Taiwan Science Park

Source: tomshardware.com

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Grand Process Technology News Today

TSMC orders more AI chip packaging equipment for Amazon, AMD, Nvidia

TSMC Accelerates Expansion of Advanced Packaging Facilities: Report

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