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June 9, 2023
Server ODMs have noted that liquid-to-air cooling designs in data center servers have entered the mainstream, with companies like Quanta Cloud Technology and Wiwynn offering liquid cooling racks.
June 9, 2023
Ichia Technologies, a flexible PCB (FPCB) and mechanism integration component supplier, expects to post a more than 20% revenue surge in 2023, buoyed by a ramp-up in shipments for automotive displays.
June 9, 2023
Metal chassis maker Catcher Technology saw May consolidated revenues pick up 19.3% on month and 33.2% on year to come to NT$2.6 billion (US$83.8 million) with the combined amount for the first five months of 2023 at NT$8.32 billion, down 19.2% on year.
June 8, 2023
Periscope and glass-plastic (G+P) hybrid lenses will become the norm as high-end smartphones gain popularity, according to Adam Lin, chairman of smartphone lens module maker Largan Precision.
June 8, 2023
Touch module maker TPK has disclosed plans to form a joint venture with HD Renewable Energy (HDRE) to develop and produce energy storage systems and charging piles for electric vehicles (EVs). The joint venture aims to capitalize on Taiwans emerging energy storage business opportunities and the booming EV charging pile market worldwide.
June 7, 2023
Apples innovative UltraFusion packaging architecture relies on TSMCs 3DFabric packaging platform, according to industry sources.
June 7, 2023
Due to a slump in both volume and prices, revenue in the enterprise SSD market fell 47.3% sequentially to nearly US$2 billion in the first quarter of 2023, according to TrendForce.
June 6, 2023
Artificial intelligence (AI) may not trigger replacement demand for consumer electronics until at least 2024, according to sources at IC design houses.
June 6, 2023
Full HD (FHD), or 1080p, will overtake 720p as the standard for computing products, according to CMOS image sensor (CIS) supplier OmniVision Technologies.
June 6, 2023
In the face of a global demand slowdown, AI remains a hot topic and gradually shows its importance across all industries. However, with computing power continuously expanding and data storage access increasingly frequent, the issue of power consumption is also becoming more and more apparent. Because of this, heat dispersion/cooling solutions are receiving much attention.